this post was submitted on 05 Nov 2025
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...Is it that interchangeable?
TBH I know little of memory fabs and HBM ICs, but I know (say) TSMC can't just switch from a power-optimized process to a high frequency one at the drop of a hat.
Slightly different part, same process. The bigger bottleneck is packaging - HBM is 3d stacked.
Ah. Yeah. And its on the fab to do that.
I always though it'd be cool for CPUs to switch to packaged RAM, too. Samsung apparently tried to do it with Wide I/O for mobile ARM stuff, but it never caught on.